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Materials in Microelectronic and Optoelectronic Packaging. Ceramic Transactions Volume 33
Hung C. Ling
/ Columbus: The American Ceramic Society 1993
471 pp., hardcover, THIS IS A BRAND NEW, NEVER-OPENED BOOK!!. Volumes
Included: 1
ISBN: 0944904637
Subject/Keywords: bakelev ceramics
Item #: 329939
$4.38